As mobile communication requirements continue to explode beyond 5G, current solutions using spatial multiplexing in bandwidth-limited sub-6-GHz frequencies, suffers from crowded spectrum occupancy. The use of frequencies above 100 GHz is already on the horizon—but also breaks the current CMOS-centric approach. Understanding the latest development in CMOS and III/V semiconductors will be key, as this combination alleviates frequency limitations of CMOS. The design of heterogenous platforms offers significant benefits in output power and efficiency, while providing a small form factor even with flexible beamforming architectures, enabling extreme speed point-to-(multi)point links. Exploring the roadmap of 100 Gb/s links above 100 GHz, combining integrated CMOS and III/V devices with advanced RF system, architecture and circuit concepts to reach an e2e energy consumption significantly below 1 nJ/bit.