High-performance PCBs and IC-substrates are critical to electronic system design, directly affecting integration- and interconnect density through their electrical, thermal, and mechanical characteristics. Particularly in RF analog and high-speed digital circuits, electrical performance is highly sensitive to the configuration of the PCB or IC-substrate. To meet application-specific system requirements, an enhanced understanding of manufacturing techniques, materials and transmission line types is inevitable for properly designing a stack-up. This webinar explores state-of-the-art PCB and IC-substrate manufacturing technologies matured for high-end mmWave applications. It includes broadband characterization of various planar transmission lines, evaluation of low-loss dielectric materials, and analysis of conductor surface roughness effects on both frequency- and time-domain system performance.